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Integrated circuit, hybrid and multichip module package design guidelines a focus on reliability
Integrated circuit, hybrid and multichip module package design guidelines a focus on reliability
Pecht Michael G.1993
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Main title:
Integrated circuit, hybrid and multichip module package design guidelines a focus on reliability
Author:
Pecht Michael G.
Imprint:
John Wiley 1993
Collation:
426p : ill / Hbk
ISBN:
9780471594468
Dewey class:
621.381046670
Local class:
621.381Pe(399)
Language:
English
BRN:
1851132
Bookmark link:
https://manchester.spydus.co.uk/cgi-bin/spydus.exe/ENQ/WPAC/BIBENQ?SETLVL=&BRN=1851132
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